23rd Electronic components conference, Statler Hilton, Washington, D.C., May 14-16, 1973. Proceedings

Författare
(Sponsored by the Electronics industry association and the Parts, material and packaging group of the Institute of electrical and electronics engineers.)
Språk
Engelska
Förlag År Ort Om boken ISBN
the Inst. 1973 USA, New York, N.Y 363 sidor. Ill.